System In Package (SiP)

Research

• A Modular System In Package Approach For Automotive Short Range Radar Applications (Ruhr Univ. Bochum, Fraunhofer et al.)

  Published on October 3, 2025

• Systems-in-Package: Authenticated Partial Encryption Protocol For Secure Testing (U. of Florida)

  Published on November 12, 2024

• Open-Source, Chiplet-Compatible RISC-V Controller

  Published on October 22, 2024

• Chiplet Hardware Security Module To Mitigate Security Vulnerabilities In SiP Systems (Univ. of Florida)

  Published on April 9, 2024

• UCIe-3D: SiP Architectures With Advanced 3D Packaging With Shrinking Bump Pitches (Intel)

  Published on March 12, 2024

Blogs & White Papers

• Advanced Packaging Changes The Rules For Semiconductor Health And Performance Management

  Published on September 14, 2026

• Advanced Packaging: A Key Technology For The Next Generation Of Electronics

  Published on October 16, 2025

• Accelerating Scalable Computing

  Published on June 2, 2025

• AI And Semiconductor In Reciprocity

  Published on March 20, 2025

• Simultaneous Bi-Directional Signaling: A Breakthrough Alternative For Multi-Die Assemblies

  Published on August 29, 2024

• Development Of Capacitance Measurement Unit For A System Level Tester

  Published on June 20, 2024

• Fluid Dispensing For Packaging Today’s Devices

  Published on December 12, 2023

• Heterogeneous Integration Co-Design Won’t Be Easy

  Published on October 13, 2022

• Thermal Simulation Of DSMBGA And Coupled Thermal-Mechanical Simulation Of Large Body HDFO

  Published on September 15, 2022

• Enabling The 5G RF Front-End Module Evolution With The DSMBGA Package

  Published on July 21, 2022

• Warpage Of Compression Molded SiP Strips

  Published on February 17, 2022

• The New Technology Solutions For Advanced SiP Devices

  Published on November 18, 2021

• The New Technology Solutions For Advanced SiP Devices

  Published on October 21, 2021

• 3D Stacking For Performance And Efficiency

  Published on April 8, 2021

• Addressing IC Hyperconvergence Design Challenges

  Published on March 11, 2021

• Wafer Prep Key To Thinning SiP

  Published on December 17, 2020

• Packaging Demands For RF And Microwave

  Published on October 22, 2020

• Enabling Cost-Effective, High-Performance Die-to-Die Connectivity

  Published on July 9, 2020

• System-in-Package For Heterogeneous Designs

  Published on December 12, 2019

• Automation And Correct By Construction Will Empower 3D-IC Adoption

  Published on June 27, 2019
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