Special Reports

Designing Electro-Optical Chips

By: Ann Mutschler

Photonics is forcing EDA to verify not just chips, but the physics of light inside full electro-optical systems.
When The Test Cell Lies

By: Gregory Haley

As margins shrink and dies move into expensive packages, separating device failures from test-cell artifacts has become a first-order economic...
Rethinking Chip Verification

By: Ann Mutschler

Specification engineering is gaining traction as a potential solution to the verification bottleneck.

 more »

Top Stories

Self-Driving Cars Have An Aging Problem

 AI workloads are pushing automotive sensors harder, forcing engineers to rethink how lo...
August 3rd, 2026 By Brendan Heffernan

Compute Clusters Break Out Of National Labs To Scale AI

 For compute-intensive applications, clusters of nodes that act as a single computer off...
July 30th, 2026 By Liz Allan

Flat Enough? Warpage Management Gets Harder In Advanced Packaging

 As packages get larger and thinner, warpage is becoming a process-control problem rathe...
July 29th, 2026 By Gregory Haley

Preparing For AI-Driven Chip Design And Verification

 Jobs, markets, and economics are undergoing dramatic changes, but it's still too early ...
July 27th, 2026 By Ed Sperling

Untangling Chip Traffic Jams

 Scaling NoCs across chiplets requires earlier validation of coherency, congestion, ther...
July 23rd, 2026 By Liz Allan

The Impact Of AI Automation On Chip Design

 Change is coming, but how quickly depends on the availability of data and when chipmake...
July 23rd, 2026 By Brian Bailey

From Highways To Health Care: Portability Proves Key To Physical AI

 Success at the edge takes advantage of common threads — lithography, imaging, chiplet...
July 22nd, 2026 By Laura Peters

Data Center Chokepoints Tied To AI, Political Pressure, Supply Chain

 Technical, political, and supply chain challenges are complicating data center buildout...
July 20th, 2026 By Brendan Heffernan

Can Fine-Pitch Hybrid Bonding Go High Volume?

 Hybrid bonding already works in production, but finer-pitch die-to-wafer integration mu...
July 16th, 2026 By Gregory Haley

New Nonvolatile Memory Winners Emerge

 RRAM, MRAM have promising futures, while FeRAM lurks, and UltraRAM plans a debut.
July 16th, 2026 By Bryon Moyer

Alternative Materials For Hybrid Bonding

 Nanotwinned copper, SiCN, BCB, and passivating metals are all possibilities
July 16th, 2026 By Katherine Derbyshire

AI In Chip Design: Lots Of Promise, Plenty Of Unanswered Questions

 Where AI will be successful, who will benefit, and how that will affect the design proc...
July 15th, 2026 By Ed Sperling

Startup Funding: Q2 2026

 Plenty of cash for AI and its enablers; 80 startups raise over $6B.
July 13th, 2026 By Jesse Allen

AI Is Rewriting The IP Playbook

 As the semiconductor ecosystem pivots to AI, it is transforming how IP is created, veri...
July 9th, 2026 By Ann Mutschler

Where Does Quantum Computing Stand?

 It's slowly emerging from research and heading toward high-volume production.
July 9th, 2026 By Bryon Moyer

An AI Model Fit For Purpose

 Using models outside the context in which they were created for can result in misleadin...
July 9th, 2026 By Brian Bailey

Multi-die Testing In The Field Must Build On Established Test Methodologies

 Having a device that works at time zero is no longer a guarantee of reliability over it...
July 7th, 2026 By Laura Peters

Inspection And Metrology Catching Up For High-Density Fan-Out Panel Packaging

 Optical methods need to comply with increasing warpage, finer RDL pitch, and trace size.
July 7th, 2026 By Anne Meixner

AI Data Centers And Auto Industry Converge On Same Issues

 The EV revolution relies on battery innovation, while AI data centers need a range of n...
July 2nd, 2026 By Liz Allan

Defending Against AI-Enabled Data Fusion

 As multimodal AI fuses data from billions of devices, attackers can weaponize detailed ...
July 2nd, 2026 By Ann Mutschler

more top stories »

Latest News

Chip Industry Week In Review

 DAC's big buzz; CHIPS Act $; China's immersion DUV; UMC expands; SIA's state of the industry; DRAM shortages; earnings; PCB design credential program; IBM's quant...
July 31st, 2026 By The SE Staff

Blog Review: July 29

 Rethinking AI compute; DFI 6; 3D-IC reliability; local AI in browser; surface prep and cleaning.
July 29th, 2026 By Jesse Allen

Chip Industry Week In Review

 Amkor's $1.5B deal; Intel Foundry revenue up 31%; Siemens' dual buys; SiC plant dies; AMD's big week; TSMC price hike; Nokia's fab buy; earnings; $300M for accele...
July 24th, 2026 By The SE Staff

more news »



Opinion

Why the Semiconductor Industry Needs A Common Language For Functional Safety

 A standardized way for future automation.
July 27th, 2026 By Alessandra Nardi

Change Is Tough

 There has never been a time when change has become something e...
July 13th, 2026 By Brian Bailey

more opinions »



Research

Chip Industry Technical Paper Roundup: July 28

 HW methods to throttle AI; M3D DRAM; interconnect signal-integ...
By Linda Christensen

Research Bits: July 28

 Photonics: Inverse design; slowing down light; on-chip electro...
By Jesse Allen

Chip Industry Technical Paper Roundup: July 21

 Near-memory HBM for LLM inference; processing-in-memory for 3D...
By Linda Christensen

more research »



Startup Corner

Startup Funding: Q2 2026

 Plenty of cash for AI and its enablers; 80 startups raise over...
By Jesse Allen

Startup Funding: Q1 2026

 Massive rounds for AI, EDA, and manufacturing; 80 startups rai...
By Jesse Allen

more startups »

Videos

AI Agent Orchestration For ASIC Autonomy

July 27th, 2026

Verifying Networks On Chip

July 20th, 2026

AI Models On The Edge

July 14th, 2026

How Far Left Can You Shift?

June 24th, 2026

Knowledge Centers / Entities, people and technologies explored

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