Leonid Kulskyi

Testing AoA, beamforming, and MIMO systems is often slowed by complex multi-instrument setups and calibration challenges. This webinar shows how the Keysight MXG signal generator streamlines the process with four phase-coherent DDS channels and tight integration with the Keysight MXR #oscilloscope and vector signal analysis #software. You’ll see how to reduce setup errors, align signals quickly, perform match correction in minutes, and achieve consistent multiantenna results. Watch the full session to elevate your #RF testing: https://gag.gl/6ixSWL

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𝐖𝐡𝐚𝐭 𝐝𝐨𝐞𝐬 𝐭𝐡𝐞 𝐂𝐲𝐛𝐞𝐫 𝐑𝐞𝐬𝐢𝐥𝐢𝐞𝐧𝐜𝐞 𝐀𝐜𝐭 𝐦𝐞𝐚𝐧 𝐟𝐨𝐫 𝐭𝐡𝐞 𝐞𝐦𝐛𝐞𝐝𝐝𝐞𝐝 𝐢𝐧𝐝𝐮𝐬𝐭𝐫𝐲?🔐 At Embedded World we spoke with Jenirathese Nadar from NXP Semiconductors and Maik Otto from PHYTEC Messtechnik GmbH about the 𝐂𝐲𝐛𝐞𝐫 𝐑𝐞𝐬𝐢𝐥𝐢𝐞𝐧𝐜𝐞 𝐀𝐜𝐭, common 𝐦𝐢𝐬𝐮𝐧𝐝𝐞𝐫𝐬𝐭𝐚𝐧𝐝𝐢𝐧𝐠𝐬, and the questions companies are currently asking around CRA and 𝐏𝐒𝐀 𝐜𝐞𝐫𝐭𝐢𝐟𝐢𝐜𝐚𝐭𝐢𝐨𝐧. This short interview gives you a first impression of the topic — but there is much more to discuss. That’s exactly why we’re hosting a 𝐰𝐞𝐛𝐢𝐧𝐚𝐫 on 📅 Thursday, March 26, 2026, where we’ll take a closer look at the challenges, requirements, and practical implications. With 𝟔𝟎𝟎+ 𝐫𝐞𝐠𝐢𝐬𝐭𝐫𝐚𝐭𝐢𝐨𝐧𝐬 already, interest is high and available places are limited. More information in the comments 👇

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Watch this video if you'd like to learn how to easily spot EMC issues during the PCB design review process. With 10+ years of field experience, this really feels like a second nature to me, but I think it's a skill that can be learnt by anyone. In this video, I use Altium Designer, though you can apply these principles in any PCB design CAD, or even during the review of fabrication files. If you'd like to learn more, also check out the Dr EMC AI-based PCB diagnostics tool. This tool is specifically tailored for finding potential EMC issues in your Gerber files, without using learning algorithms or violating your IP - https://lnkd.in/enespmZ3 #pcb #EMC #electronicdesign #circuits https://lnkd.in/efGEYmT8

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𝐂𝐨𝐧𝐬𝐢𝐝𝐞𝐫𝐚𝐭𝐢𝐨𝐧𝐬 𝐟𝐨𝐫 𝐂𝐮𝐫𝐫𝐞𝐧𝐭 𝐁𝐚𝐥𝐚𝐧𝐜𝐢𝐧𝐠 𝐢𝐧 𝐏𝐚𝐫𝐚𝐥𝐥𝐞𝐥𝐞𝐝 𝐒𝐢𝐂 𝐏𝐨𝐰𝐞𝐫 𝐌𝐨𝐝𝐮𝐥𝐞𝐬 Balancing current in paralleled SiC modules is crucial for performance, requiring focus on device parameter matching (Rdson, Vth), layout symmetry (busbar inductance, loop area), gate driver design (delay, resistance), and thermal management, using strategies like passive impedance matching (resistors, inductors) or active feedback control to manage steady-state & transient mismatches, preventing overstress, oscillation, and derating for higher reliability in high-power applications.

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Choosing the right PCB layer count isn't just about space — it impacts signal integrity, power delivery, and cost. Here’s a quick breakdown: -) 2-Layer Board Simple and cheap. Ideal for basic designs, but not great for high-speed signals or dense routing. -) 4-Layer Board A sweet spot for many. Allows better signal routing and solid ground/power planes. Great for noise control and moderate complexity. -) 6-Layer Board Best for high-speed, high-density designs. More routing layers = better EMI control, impedance matching, and thermal performance — but at a higher cost. Bottom line: Stack-up isn't just about how many layers — it's about design goals and performance requirements. what do you think 🤔 Need help in electronics product design for your next project? Reach out for expert PCB design support or mentorship. Repost #PCBDesign #HighSpeedDesign #Electronics

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PCB procurement checklist for #hardwareengineers - When procuring PCBs, engineering and sourcing teams should follow a structured checklist that validates BOM accuracy and assesses fabricator capabilities. - As a hardware engineer, NPI lead, or procurement manager, you must verify component lifecycle status, define attrition buffers, and evaluate cost impact before issuing purchase orders (PO). Article highlights: -> Component sourcing represents 60 - 80% of total printed board cost and is the leading cause of procurement-related delays. -> Defining attrition buffers prevents kit shortages, partial builds, and assembly schedule slippage. -> End-of-life (EOL) components must be identified during schematic and pre-release BOM reviews to prevent production interruptions. -> Checklist-based board procurement improves engineering and supply chain alignment. Read the article to learn the complete procurement checklist to help you prevent delays, sourcing risks, and maintain product launch schedules: https://lnkd.in/gF-eXWc3 --> Repost if you find it useful. #pcbdesigners #productdesigners #pcbfabrication #pcbassembly

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